Dispensing Technology for Assembly Processes
In assembly processes, individual components, housings, printed circuit boards, sensors, connectors or mechanical parts are joined to form a functional unit. Adhesives, sealants, greases, thermal interface materials or potting compounds are often used. It is essential that each material is applied cleanly, repeatably and in the correct position.
Precise dispensing technology reliably supports assembly processes, whether individual dots, lines, beads or defined material quantities are required. Depending on the component, material and production volume, dispensing can be performed manually, semi-automatically or automatically. This enables consistent results, reduces rework and supports efficient material use.
Typical requirements
Typical materials
Automated sealing and bonding of two housing sections for an electronic control unit with an additional intermediate plate. The material is applied along a complex contour using a volumetric dispensing valve. Material is supplied from a Euro cartridge installed in a cartridge sleeve with a follower piston and empty-level sensor. The valve and material supply are mounted on an X-Y-Z cross-slide, allowing the dispensing tip to be precisely realigned after replacement. The system is installed on a WRA-500 dispensing robot with a protective enclosure and mechanical door. For precise path guidance, a DXF file of the contour was imported into the robot programming software.
Available immediately
Delivery time on request
Material, viscosity, dispensing volume, component geometry and the desired level of automation are key factors when selecting the right dispensing technology. We will be happy to analyze your application and recommend a suitable solution.