Dispensing Solder Paste Cleanly and Repeatably
Solder paste is used in electronics manufacturing to create electrical and mechanical connections between components and printed circuit boards. It consists of fine metal powder and flux and must be applied evenly, cleanly and in the correct quantity. Controlled dispensing is particularly important for small pads, tight component spacing or selective rework.
With suitable dispensing technology, solder paste can be applied precisely from cartridges, for example as dots, lines or defined quantities onto individual contact areas. Material properties such as viscosity, particle size and flow behavior must be taken into account. A suitable dispensing tip, stable pressure setting and reproducible dispensing time ensure reliable processing of the solder paste. Depending on the application, dispensing can be performed manually, semi-automatically or automatically using a dispensing robot.
Typical requirements
Typical materials
Automated dispensing of solder paste onto a printed circuit board. The solder paste is applied precisely to defined contact areas in order to provide a clean and repeatable material quantity for the subsequent soldering process. The cartridge is mounted on a cross-slide on the WRA-500 dispensing robot, which allows the dispensing tip in particular to be adjusted easily and precisely after replacement. Material dispensing is controlled by an IG-1500D dispensing controller connected to the cartridge.
Available immediately
Delivery time: Available immediately
Available immediately
Material, viscosity, dispensing volume, component geometry and the desired level of automation are key factors when selecting the right dispensing technology. We will be happy to analyze your application and recommend a suitable solution.